| 翻訳と辞書 |
| Bead probe technology ： ウィキペディア英語版 |
Bead probe technology
Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT).〔 http://www.home.agilent.com/agilent/editorial.jspx?action=download&cc=US&lc=eng&ckey=873640&id=873640〕〔 http://www.agilent.com/see/beadprobe〕 It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.
==Description==
Bead probe technology is a probing method used to connect electronic test equipment to the device under test (DUT) within a bed of nails fixture. The technique was first used in the 1990s〔Surface Mount & Mixed Technology PCB Design Guidelines by David Boswell. Page 28 ISBN 1-872422-01-2〕 and originally given the name “Waygood Bump” after one of the main proponents, Rex Waygood. They are also commonly referred to as solder bumps.〔Surface Mount Technology – Principles and Practices 2nd Edition by Ray. P Prasad Page 332 ISBN 0-412-12921-3 〕 Bead probes were designed for when less than 30 mil is available for test probe points on the PCB. They are used with standard ICT spring-loaded test probes to connect the test equipment to the DUT.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
■ウィキペディアで「Bead probe technology」の詳細全文を読む
スポンサード リンク
| 翻訳と辞書 : 翻訳のためのインターネットリソース |
Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.
|
|